WFM700 Series Waveform Monitors Service Manual 4-1
This chapter contains the information needed to do periodic and corrective
maintenance on the instrument. The chapter is divided into four main sections.
HGeneral Maintenance (this section) — Introduction plus general information
on preventing damage to internal modules and cleaning instructions.
HRemoval and Installation Procedures — Procedures for the removal of
defective modules and replacement of new or repaired modules. Also
included is a procedure for disassembly of the instrument for cleaning.
HTroubleshooting — Information for isolating and troubleshooting failed
modules. Included are instructions for operating the instrument’s internal
diagnostic routines and troubleshooting trees. Most of the trees make use of
these internal diagnostic routines to speed fault isolation to a module.
HRepackaging Instructions -- Information to safely package the instrument for
Firmware upgrades for the waveform monitor become available periodically and
can be downloaded from the Tektronix, Inc. Web site (www.tektronix.com).
Instructions for obtaining and installing updated firmware is located in the
WFM700 Series Technical Reference document.