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Table of Contents
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M68060 USER’S MANUAL
MOTOROLA
2.3.6 Transfer Size (SIZ1, SIZ0).......................................................................... 2-6
2.3.7 Bus Lock (LOCK)........................................................................................ 2-6
2.3.8 Bus Lock End (LOCKE).............................................................................. 2-6
2.3.9 Cache Inhibit Out (CIOUT) ......................................................................... 2-7
2.3.10 Byte Select Lines (BS3–BS0)..................................................................... 2-7
2.4 Master Transfer Control Signals ................................................................... 2-7
2.4.1 Transfer Start (TS)...................................................................................... 2-8
2.4.2 Transfer in Progress (TIP) .......................................................................... 2-8
2.4.3 Starting Termination Acknowledge Signal Sampling (SAS) ....................... 2-8
2.5 Slave Transfer Control Signals ..................................................................... 2-8
2.5.1 Transfer Acknowledge (TA)........................................................................ 2-8
2.5.2 Transfer Retry Acknowledge (TRA)............................................................ 2-8
2.5.3 Transfer Error Acknowledge (TEA) ............................................................ 2-9
2.5.4 Transfer Burst Inhibit (TBI) ......................................................................... 2-9
2.5.5 Transfer Cache Inhibit (TCI) ....................................................................... 2-9
2.6 Snoop Control (SNOOP) .............................................................................. 2-9
2.7 Arbitration Signals....................................................................................... 2-10
2.7.1 Bus Request (BR)..................................................................................... 2-10
2.7.2 Bus Grant (BG)......................................................................................... 2-10
2.7.3 Bus Grant Relinquish Control (BGR)........................................................ 2-10
2.7.4 Bus Tenure Termination (BTT)................................................................. 2-10
2.7.5 Bus Busy (BB) .......................................................................................... 2-11
2.8 Processor Control Signals .......................................................................... 2-11
2.8.1 Cache Disable (CDIS) .............................................................................. 2-11
2.8.2 MMU Disable (MDIS)................................................................................ 2-12
2.8.3 Reset In (RSTI)......................................................................................... 2-12
2.8.4 Reset Out (RSTO) .................................................................................... 2-12
2.9 Interrupt Control Signals ............................................................................. 2-12
2.9.1 Interrupt Priority Level (IPL2–IPL0) .......................................................... 2-12
2.9.2 Interrupt Pending Status (IPEND) ............................................................ 2-12
2.9.3 Autovector (AVEC) ................................................................................... 2-13
2.10 Status and Clock Signals............................................................................ 2-13
2.10.1 Processor Status (PST4–PST0)............................................................... 2-13
2.10.2 MC68060 Processor Clock (CLK) ............................................................ 2-14
2.10.3 Clock Enable (CLKEN) ............................................................................. 2-14
2.11 Test Signals ................................................................................................ 2-15
2.11.1 JTAG Enable (JTAG)................................................................................ 2-15
2.11.2 Test Clock (TCK) ...................................................................................... 2-15
2.11.3 Test Mode Select (TMS)........................................................................... 2-15
2.11.4 Test Data In (TDI)..................................................................................... 2-16
2.11.5 Test Data Out (TDO) ................................................................................ 2-16
2.11.6 Test Reset (TRST) ................................................................................... 2-16
2.12 Thermal Sensing Pins (THERM1, THERM0).............................................. 2-16
2.13 Power Supply Connections......................................................................... 2-16
2.14 Signal Summary ......................................................................................... 2-16
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